Exhibit packages for Flexible Sensors 2016 Workshop are available. For further information and questions about exhibiting, please click here.


Microelectronics assembly technologies including: advanced packaging and SMT assembly on PCB, PCB-FLEX and ceramic substrates. We support high complexity and small miniature assemblies from prototype to production. Our Silicon Valley facility includes 2,500 square feet cleanroom ISO 7 with on-site process development, engineering and manufacturing support. Advanced packaging: We support precision die attach and flip chip with DATACON 2200 EVO Plus; wire bond (Au ball, Au wedge, Al wedge) with KNS ICONN and H&K BJ820 and BJ815; and encapsulation with Glob Top, dam & fill and UV materials with ASYMTEK S820 with dispense jet and auger pumps. SMT assembly: Lead-free with 01005, BTC, QFN, WLCSP, uBGA and 0.4mm pitch IC and connectors; PCB from 0.012” to 0.200”; PCB-FLEX from 0.004” to 0.010”; and ceramic 0.010” to 0.040” thickness.


Chromaline Screen Print Products, an IKONICS Company, is a world leading manufacturer of products specifically engineered for high-tolerance electronics and industrial screen printing applications. Chromaline's new Alpha FlexTrace T15 advanced flexible PET substrate technology; provides substantial improvement in printed conductor resolution, edge definition, and line-width accuracy when combined with industry standard conductive inks and printing equipment. This improvement in substrate engineering makes higher density, micro-line precision circuits possible--engineers can design more compact electronics, and press operators gain setup latitude and repeatability. Combine Alpha FlexTrace T15 with Chromaline's Alpha micro-line stencils to print precision traces and spaces below 50-microns. Conducting business in over 90 countries, Chromaline has been servicing industrial printers for over a quarter century, challenging the fundamentals of screen making, improving printing processes and altering what is possible in electronics and industrial printing applications. Visit us on the exhibit floor, table #1, to learn more about the Alpha product line and how to improve print quality.


For more than 35 years, Delphon has developed breakthrough products, like Gel-Pak®, that provide solutions for manufacturing processes in a wide range of industrial markets. Delphon’s material scientists and R&D engineers work closely with customers to innovate customized polymer and adhesive materials used by the electronics and medical industries. Delphon supports customer from concept through commercial manufacturing.


FRT is recognized as a valued partner for non-contact, optical metrology systems. FRT of America serves you by providing high quality automated measuring tools which fulfill your research, inspection and process verification needs. Delivering increased manufacturing yield, enhanced productivity, improved quality and product performance, because that’s what it’s about at the end of the day. The MicroProf TTV measures samples thickness, TTV, bow and warp for full thickness, thinned and bonded wafers and substrates. The MicroSpy Topo DT is a high resolution 3D microscope with confocal and interferometric measuring modes for a wide range of applications.


IMT offers the most complete MEMS foundry services in our fully automated 30,000 sq ft, 6” wafer fab. IMT’s extensive product experience includes DC and RF switching, drug discovery/delivery, microfluidics, cell sorting, inertial navigation, optotelecom, IR emitters, and others. IMT offers wafer bonding for both hermetic packaging/encapsulation and microfluidics including: fusion bonding, anodic bonding, glass frit bonding, Au-Au thermocompression bonding, metal alloy bonding and various types of polymer bonds. IMT’s wafer-level packaging and through silicon via technologies are production proven for the next generation 3D packaging and interposer applications. IMT is ISO 9001 certified offering complete turn-key foundry services from design through high-volume production. We bring our customers’ MEMS to volume production. Speak with an IMT representative to see how we can make your MEMS work for you.


As a major supplier in the semiconductor industry for more than 25 years, Teikoku Taping System specializes in designing, developing, and manufacturing custom-engineered backend semiconductor equipment used for MEMS dry film resist lamination, dicing tape-and-die attach film mounting, back grind tape lamination, and UV irradiation.

Exhibit Opportunities

The exhibit area will be open to the public during the workshop. The exhibit package is only $695 and includes the following:

  • One (1) workshop and reception admission
  • Printed workshop program and presentation slides in electronic format
  • One (1) 6-foot table, draped
  • Two (2) chairs
  • Custom 11”x17” tabletop sign with company logo and description
  • Company logo and description in the printed workshop program and on printed workshop signage
  • Company logo and description on event website
  • Company logo and description on event dedicated emails to subscribers of MEMS Journal and our media partners; event promotions will reach 70,000 to 80,000 individuals in the sensors, electronics, MEMS, and semiconductor industry segments.

Upgrade to the Deluxe Exhibitor option which enables you to give a 10-minute talk to the entire audience during the Technology Showcase. It's a great way to draw more attention to your company. Deluxe Exhibitor and Technology Showcase spots are limited – click here to register today!

For further information about exhibiting, please contact Jessica Ingram at jessica@memsjournal.com or call 360-929-0114.

Exhibit space is limited. Sign up today!